1,Tin ball

1), solder paste dealing processing

2), parameter control during printing

3), collapse occurs during the Pick and Place process

4), the printed board itself is dirty

5), SMT steel mesh opening is unreasonable

6), reflow curve parameters 

2,Bridge

1),stickyly

2), the printing parameter is not set properly.

3), snap off too big

4), improper mixing, solder paste is not completely mixed

3, Too much or too less Tin

1), steel mesh opening;

2), the type of scraper;

3), Snap off is not the right distance

4), support system

4, Component offset

1), the solder paste adhesion is not enough to keep the components in the corresponding position, the component is detached when the chain shakes or the emergency stop

2), the solder paste exceeds the service life;

3), the placement machine vacuum system is unstable;

4), the solder paste is unbalanced after printing;

5), the flux specific gravity is too high, the component drifts during the flow of the flux.

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