Basic knowledge of PCB copper foil
1. Introduction of copper foil
Copper foil (copper foil): an anionic electrolytic material, a thin, continuous metal foil deposited on the base layer of the circuit board, which acts as a conductor of the PCB. It easily adheres to insulating layers, accepts printed protective layers, and forms circuit patterns after etching. Copper mirror test: A flux corrosion test using a vacuum deposited film on a glass plate.
Copper foil is made of copper plus a certain proportion of other metals. Generally, there are two types of copper foil: 90 foil and 88 foil, that is, the copper content is 90% and 88%, and the size is 16*16cm. Copper foil is the most versatile decorative material. Such as: hotels, temples, Buddha statues, golden signs, tile mosaics, handicrafts, etc.
2. Product Features
Copper foil has low surface oxygen characteristics and can be attached to various substrates, such as metals, insulating materials, etc., and has a wide temperature range. Mainly used in electromagnetic shielding and anti-static, the conductive copper foil is placed on the substrate surface, combined with the metal substrate, it has excellent conductivity, and provides the effect of electromagnetic shielding. It can be divided into: self-adhesive copper foil, double-conductive copper foil, single-conductive copper foil, etc.
Electronic grade copper foil (purity above 99.7%, thickness 5um-105um) is one of the basic materials of the electronic industry. The electronic information industry is developing rapidly, and the use of electronic grade copper foil is increasing. The products are widely used in industrial calculators, Communication equipment, QA equipment, lithium-ion batteries, civilian televisions, video recorders, CD players, copiers, telephones, heating and cooling air conditioners, automotive electronic components, game consoles, etc. The demand for electronic-grade copper foil, especially high-performance electronic-grade copper foil, is increasing in domestic and foreign markets. Relevant professional institutions predict that by 2015, China’s domestic demand for electronic-grade copper foil will reach 300,000 tons, and China will become the world’s largest manufacturing base for printed circuit boards and copper foils. Electronic-grade copper foils, especially high-performance foils, are optimistic about the market. .
3. The global supply of copper foil
Industrial copper foil can be commonly divided into two categories: rolled copper foil (RA copper foil) and spot solution copper foil (ED copper foil). Copper foil, and electrolytic copper foil has the advantage of lower manufacturing cost than rolled copper foil. Since rolled copper foil is an important raw material for flexible boards, the improvement of properties and price changes of rolled copper foil have a certain impact on the flexible board industry.
Since there are few manufacturers of rolled copper foil, and the technology is also in the hands of some manufacturers, the customer has a low degree of control over the price and supply, so on the premise of not affecting the product performance, the electrolytic copper foil is used instead of rolling. Copper foil is a viable solution. However, if the physical properties of the copper foil structure will affect the etching factor in the next few years, the importance of rolled copper foil will increase again in thin-line or thin products, and high-frequency products due to telecommunication considerations.
There are two major obstacles to the production of rolled copper foil, resource obstacles and technical obstacles. The obstacle of resources means that the production of rolled copper foil needs to be supported by copper raw materials, and it is very important to occupy resources. On the other hand, technical obstacles have deterred more new entrants. In addition to rolling technology, surface treatment or oxidation treatment technology is also. Most of the global manufacturers have many technical patents and key technology Know How, increasing the barriers to entry. If the new entrants post-harvest processing and production, they will be restricted by the cost of big manufacturers, and it will not be easy to successfully enter the market. Therefore, the global rolled copper foil is still a strong exclusive market.
4.the development of copper foil
Copper foil is electrodepositedcopperfoil in English, which is an important material for copper clad laminate (CCL) and printed circuit board (PCB) manufacturing. In the rapid development of today’s electronic information industry, electrolytic copper foil is called: the “neural network” of electronic product signal and power transmission and communication. Since 2002, the production value of China’s printed circuit boards has become the third largest in the world, and as the substrate material of PCB, copper clad laminate has also become the third largest producer in the world. As a result, China’s electrolytic copper foil industry has developed by leaps and bounds in recent years. In order to understand and understand the past, present and prospect of the development of the world and China’s electrolytic copper foil industry, experts from China Epoxy Resin Industry Association specially reviewed its development.
From the perspective of the production department and market development and changes of the electrolytic copper foil industry, its development process can be divided into three major development periods: the period when the United States created the first world copper foil enterprise and the electrolytic copper foil industry started; Japanese copper foil The period when enterprises fully monopolize the world market; the period when the world multi-polarity competes for the market.