Category Archives: Post

028 月/22

Printing and solder paste quality precautions

2 8 月, 2022PostCombined with the printing process of solder paste, EMS, PCB, PCB assembly, Printing and solder paste quality, SMT, SMT consumables, SMT process, SMT spare parts, solder paste, Surface Mount Technology, The printing quality decreases, The process window of solder paste printing is determined through experiments., The single process parameters of scraper pressure, The speed of the scraperAlice

1. The single process parameters of Read More…

297 月/22

Introduction of laser steel mesh

29 7 月, 2022PostEMS, laser steel mesh, Obvious standard gold finger, PCB, PCB assembly, SMT, SMT consumables, SMT process, SMT spare parts, solder paste, Surface Mount TechnologyAlice

Premise summary: when designing SMT Read More…

257 月/22

About laser steel mesh

25 7 月, 2022PostEMS, laser steel mesh, manually aligned, mesh specification, PCB, PCB assembly, physical plate, Selection of steel sheet thickness, SMT consumables, SMT process, SMT spare parts, solder pasteAlice

Specification and size selection of Read More…

057 月/22

Stencil wiper produced and customized

5 7 月, 2022Postcustomized, GKG printer, MINAMI printer, MPN printer, Panasonic SPG, SMT, SMT printer 's stencil wiper, special type, standard, Stencil Roll, Stencil wiper produced, YAMAHA printerAlice

We manufacture all kinds of SMT prinRead More…

017 月/22

Main technical indicators and working principle of SMT printing machine

1 7 月, 2022PostHuman respiratory system, Low efficiency of SMT steel mesh, Manual repeated purging, Red glue cleaning technology, Sprinkler equipment, The pore depth and pore diameter of red glue steel mesh are relatively large, Thorough cleaningAlice

Red glue cleaning is an important liRead More…

286 月/22

Main technical indicators and working principle of SMT printing machine

28 6 月, 2022Postindicators, leakage of the SMT stencil, Maximum printing area, MT printing machine, Printing accuracy, Printing speed, Repeatability, solder paste, solder paste causes, technical indicators, the scraper, the SMT stencil, working principleAlice

The main technical indicators of theRead More…

216 月/22

Main factors causing solder paste adhesion

21 6 月, 2022PostDesign defect of plate, Human factors are squeezed and adhered, Incorrect position of the cutout, Laser steel mesh problem, Pad spacing too small, Patch steel mesh is not wiped clean, Poor solder paste falling off, Solder paste adhesion, The fixing clamp in the printer is looseAlice

Main factors causing solder paste adRead More…

176 月/22

The main factors that lead to the offset and sharpening of the solder paste

17 6 月, 2022PostFixed clamp loose, Optical positioning system failure, Pull the tip, Solder paste offset, Solder paste viscosity and other properties, The positioning reference point is not clear, The positioning thimble is not in place, The reference point of the laser stencil is not aligned, There are burrs on the hole wall of the stencil holeAlice

A. The main factors leading to the oRead More…

146 月/22

The main factors leading to insufficient solder paste

14 6 月, 2022Postangle, circuit board, Contamination on the circuit board, Damaged scraper, demoulding speed, Fixed clamp loose, flux, Laser Stencil, Patch stencil damage, solder paste, speedAlice

1. When the printing machine is workRead More…

086 月/22

Use of solder paste

8 6 月, 2022Post5一10℃, Cleaning, laser steel, Not to be recycled, patch glue, prevent condensation, reflow soldering, refrigerator, Solder Paste Repair, stainless steel stirring rod, Use of solder paste, with finger cotsAlice

1. Must be stored at 5-10°C. 2. It iRead More…