Function analysis of suction nozzle of SMT machine

In order to realize the above functions of the nozzle of the patch machine, when people design the nozzle, they usually design the surface of the nozzle contact element into a central symmetrical shape. For the case where the nozzle background plane as the photographing background is designed as a matte surface and the surface is not mixed, of course, the background is usually designed as a single color, such as yellow and black.

Antirust lubricating oil

The suction nozzle of the mounter is not only the key part for the mounter to paste and release the sucked components, but also the background for the camera of the optical vision system to take photos. It mainly sucks the components by vacuum adsorption, and places the components adsorbed on the suction nozzle on the coordinate position of the circuit board by blowing.

When the sucking nozzle of the mounter sucks components, it is necessary to ensure that the center of the components, the center of the sucking nozzle and the spatial center of the obtained image are coincident in order to achieve the ideal situation. In fact, the adjustment of the optical vision system is also to compensate for the deviation caused by the non coincidence in the actual work.

Different mounting elements need to be sucked by different suction nozzles. Almost every suction nozzle will have a reflection background, which is mainly to have a good background during image capturing, so as to ensure that the target information can be accurately highlighted during image processing. When the suction nozzle extracts an image, the suction nozzle acts as the background, so that the image contrast of the element is enhanced and more visible

(1)Reasons for suction error of suction nozzle of SMT machine

The reason for the wrong suction of the suction nozzle of the mounter. (1) The suction nozzle is worn, and the deformation, blockage and damage of the suction nozzle lead to insufficient air pressure, which leads to the failure to suck the components. Therefore, the wear degree of the suction nozzle shall be regularly checked and the serious ones shall be replaced.

(2) The influence of the feeder: the feeder feeding is poor (the feeder gear is damaged), the feed belt hole is not stuck on the gear of the feeder, there are foreign matters under the feeder, and the clamp spring is worn), the pressure belt cover plate, the spring and other operating mechanisms are deformed and rusted, resulting in the components being biased, erected or unable to absorb the components. Therefore, regular inspection and treatment should be carried out to avoid a large amount of waste of components.

(3)The vacuum negative pressure of sony2000 suction nozzle is insufficient. When the suction nozzle takes components, a certain negative pressure will be generated at the suction nozzle, and the components will be adsorbed on the suction nozzle. The negative pressure detection method is generally used to determine whether the pick-up components of the suction nozzle are abnormal. When the detection value of the negative pressure sensor is within a certain range, the machine will consider the suction normal, otherwise, it will consider the suction bad. When the components are sucked, the vacuum negative pressure should be above 53.33kpa, so that there is enough vacuum to suck the components. If the vacuum negative pressure is insufficient, it will not be able to provide enough suction suction elements. In use, we should regularly check the vacuum negative pressure and regularly clean the suction nozzle. At the same time, we should pay attention to the pollution of the vacuum filter element on each mounting head. Its function is to filter the air source reaching the suction nozzle, and replace the polluted and blackened ones to ensure smooth air flow.

(4) Influence of suction height: the ideal suction height of the suction nozzle is 0.05mm lower when the suction nozzle is in contact with the surface of the element. If the pressing depth is too deep, the element will be pressed into the feeding groove and cannot be lifted. If the suction of a component is not good, the suction height can be adjusted slightly upward, for example, 0.05mm. In the actual work process, the author has encountered the situation that all components on a certain material table have poor absorption. The solution is to move the reclaiming height of the material table in the system parameters up a bit.

(5) There are quality problems in the packaging of chip components produced by some manufacturers, such as large error in the spacing of perforations, too large adhesive force between paper tape and plastic film, and too small size of material slot, which are all possible reasons that the components cannot be taken out.