Air stirring electroplating system, this type of process has been applied to production lines by many manufacturers, and has achieved obvious technical effects. The process system uses the printed circuit board to move the solution back and forth, so that the solution in the hole can be exchanged in time. At the same time, it uses a high-acid and low-copper electrolyte. By increasing the acid concentration, the conductivity of the solution is increased, and the copper concentration is reduced. The ohmic resistance of the solution in the hole, with the help of excellent additives, ensures the reliability and stability of the electroplating of the high aspect ratio printed circuit board. According to the characteristics of the electrolyte, in order to make the deep hole electroplating meet the technical requirements, the value of the current density must be limited. The reason is the direct influence of the ohmic resistance, not the transfer of the substance. The important thing is to ensure that there is enough current in the hole to expand the control area of the electrode reaction to the entire inner surface of the hole, so that the copper ions can be quickly converted into metallic copper. For this reason, the current density value that is conventionally used should be reduced to 50% When the over-potential in the plated through-hole is higher than the current density electroplating, sufficient current can be obtained in the hole.

Some of the techniques introduced above have been used in the production of electroplated copper on printed circuit boards with high aspect ratios, and have achieved good results. At present, the more mature pulse electroplating technology, after research and development, adopts the “timing reverse pulse” process technology to apply to the deep hole or deep blind hole electroplating of the multilayer and multilayer printed circuit boards to produce the suitable pulse electroplating The anti-pulse rectifier, so that this type of process method will be universally applied.