Laser stencil BGA opening principle:

PITCH＝0.4mm, open 0.23m

PITCH＝0.45mm, opening 0.26mm

PITCH＝0.5mm, opening 0.3mm

PITCH＝0.65mm, opening 0.35mm

PITCH＝0.8mm, opening 0.45mm

PITCH＝1.0mm, opening 0.55mm

PITCH＝1.27mm, opening 0.65mm

If the aperture on the line is too far from the data, please contact customer service

0.4 0.5 IC grounding pad, according to 60-70% of the pad, open a square hole, if the square hole is larger than 1.5, please build a bridge with a minimum width of 0.3MM and form a cross

Whether it is Tianzi or Tic-tac-toe depends on the size of the pad. If the ground pad is already small, such as about 1.0MM, there is no need to shrink it.

Note: PITCH refers to the center-to-center distance between two adjacent pads

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