Main factors causing solder paste adhesion

1. The design defect of the plate, and the spacing between pads is too small

2. There is a problem with the laser steel mesh, and the position of the cutout is incorrect

3. The steel mesh of the patch is not wiped clean

4. The SMT steel mesh causes the solder paste to fall off

5. Poor performance of solder paste, unqualified viscosity and collapse

6. The fixing clamp of the circuit board in the printer is loose

7. The pressure, angle, speed and demoulding speed of solder paste scraper are not set properly

8. After the solder paste is printed, it is extruded and adhered due to human factors