Precautions for BGA ball planting process:

A. The first step is to distinguish whether the IC has lead or lead-free technology, otherwise the IC will not meet the ROHS requirements after contamination, and the consequences will be extremely serious;

B. The second step is to bake before ball planting. IC packaging materials are generally plastic or ceramics, which are easy to absorb moisture at room temperature. If there is no baking before ball planting, it is easy to cause IC delamination and damage the chip. The industry is commonly known as the “popcorn” phenomenon;

C. After the ball is planted, the soldering should be done according to the chemical composition of the solder ball, and the corresponding temperature should be set, otherwise it is easy to cause bad phenomena such as weak ball planting, non-straight ball, and out-of-round ball;

C.1. Leaded solder balls (Sn63Pb37, 63% tin and 37% lead) have a melting point of 183°C.

C.2. Lead-free solder balls (Sn96.5Ag3Cu0.5, tin 96.5% silver 3% copper 0.5%) melting point 217°C.

D. ICs planted with balls generally need to be baked for a short time to remove the moisture adsorbed on the surface of the IC. After the baking is completed, they should be placed in a moisture-proof box, vacuum package or tape-and-reel package in time.

In order to avoid delamination and damage to the IC during IC mounting due to moisture regain;

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