The quality control of through-hole electroplating copper layer is very important, because the development of multi-layer or laminated board in the direction of high density, high precision and multi-function, the bonding force, uniformity and fineness, tensile strength and extension of the copper plating layer Requirements such as the rate are becoming stricter and higher, so the quality control of through-hole plating is particularly important. In order to ensure the uniformity and consistency of the copper electroplating layer of the through-hole, most of the copper electroplating process in the high aspect ratio printed circuit board is assisted by high-quality additives, with appropriate air stirring and cathode movement, in the relative Under the condition of lower current density, the electrode reaction control area in the hole is enlarged, and the effect of electroplating additives can be displayed. In addition, the movement of the cathode is very conducive to the improvement of the deep plating ability of the plating solution. When the degree of chemical conversion is increased, the formation speed of crystal nuclei and the growth speed of crystal grains during the electrocrystallization process of the plating layer compensate each other, so as to obtain a high-toughness copper layer.

Of course, the current density setting is based on the actual plating area of the printed circuit board to be plated. From the analysis of the original understanding of electroplating, the value of the current density must also be based on factors such as the main salt concentration of the high-acid low-copper electrolyte, the temperature of the solution, the content of additives, and the degree of stirring. In short, it is necessary to strictly control the process parameters and process conditions of copper electroplating to ensure that the thickness of the copper plating layer in the hole meets the technical standards.