SMT chip stencil cleaning methods generally include wiping and ultrasonic cleaning:

wipe:

Wipe the stencil with a lint-free cloth (or special stencil wipe) pre-soaked with cleaner to remove cured solder paste or adhesive.

It is characterized by convenience, no time limit, and low cost;

The disadvantage is that the stencils cannot be cleaned thoroughly, especially the fine-pitch stencils.

In addition, some printing machines have an automatic wiping function, which can be set to automatically wipe the bottom of the stencil after printing several times. This process also uses a special steel mesh to wipe the paper, and the machine will spray the cleaning agent on the paper before the action.

Ultrasonic cleaning:

Ultrasonic cleaning mainly includes immersion type and spray type, and some manufacturers use a semi-automatic ultrasonic cleaning machine to clean the steel mesh.

Choice of cleaning agent:

The ideal stencil cleaning agent must be practical, effective, and safe for people and the environment, and it must also be able to remove solder paste (glue) on the stencil well. Now there is a special stencil cleaning agent, but it may elute the stencil, so it should be used with caution. If there is no special requirement, alcohol or deionized water can be used instead of special cleaning agent for stencil.

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