SMT auxiliary process: mainly used to solve the mixed process of wave soldering and reflow soldering
- Printing red glue: (can also print red glue)
The function is to fix the red offset printing onto the fixed position of the PCB, mainly to fix the components to the PCB. It is generally used for surface mount components on both sides of the PCB and for wave soldering on one side. The equipment used for printing solder paste and red glue can be completed by one machine, located at the forefront of the SMT production line. - Curing: (Reflow soldering is more effective for curing and lead solder paste)
Its function is to heat and solidify the patch adhesive, thereby firmly bonding the surface mounted components and PCB together. The equipment used is a curing oven (which can also be used for curing adhesives and conducting thermal aging tests on components and PCBs), located behind the surface mount machine in the SMT production line.