1. Printing thickness

The printing thickness is determined by the thickness of the laser stencil. Of course, the setting of the machine and the characteristics of the solder paste also have a certain relationship. Micro-adjustment of printing thickness is often achieved by adjusting the squeegee speed and squeegee pressure. Appropriately reducing the printing speed of the squeegee can increase the amount of solder paste printed to the printed board. One thing is clear: decreasing the speed of the scraper equals increasing the pressure on the scraper; conversely, increasing the speed of the scraper equals reducing the pressure on the scraper.

2. Printing speed

The high speed of the scraper is conducive to the rebound of the SMT stencil steel sheet, but at the same time it will hinder the transfer of the solder paste to the printed board pad, and the too slow speed will cause poor resolution of the solder paste printed on the pad. On the other hand, the speed of the squeegee has a lot to do with the viscosity of the solder paste. Usually the speed range for fine pitch printing is 12 to 40 mm/s.