Solution impact copper electroplating process technology: It is the same process method as the principle of electroplating on the surface of the printed circuit board plug by the high-speed flowing gold liquid in the gold electroplating production line. The specific implementation method is to install two 5-horsepower motors in the electroplating tank to force the solution near the cathode to spray out the 12.7mm hole in the pipe at a pressure of 0.56-1.12kg/cm2, and shoot it towards the printed circuit board Then it flows out from the other side of the printed circuit board. The inlet and outlet pressures of the plated through holes are different. The two pipes are placed in parallel, and the solution circulates through the pipe at a flow rate of 150-250 g/min, which can improve the uniformity of the plating on the board. The cathode rotates with a radius of 50.8MM instead of moving back and forth in parallel. Impact electroplating is similar to conventional air stirring electroplating, and both rely on chemical and electrical characteristics.

This type of process method brings a series of difficulties to the manufacture of the tank system, because to meet the needs of this process method, a set of complex special pumps, special fixtures and electroplating tank structure must be designed. Whether it can be quickly applied to solve the problem of copper electroplating of small holes with high aspect ratio, it will take a long time, but from the principle analysis, it should be feasible, but great improvement is needed.