The main factors that lead to the offset and sharpening of the solder paste

17 6 月, 2022PostFixed clamp loose, Optical positioning system failure, Pull the tip, Solder paste offset, Solder paste viscosity and other properties, The positioning reference point is not clear, The positioning thimble is not in place, The reference point of the laser stencil is not aligned, There are burrs on the hole wall of the stencil holeAlice