1: When a fault occurs, it is recommended to solve the problem as follows:

A: Detailed analysis of the working order of the devices and the logical relationship between them.

B: Understand the location, segment and extent of the fault, and whether there is abnormal sound.

C: Understand the operation process before the failure occurs.

D: Whether it occurs on a specific placement head or nozzle.

E: Whether it occurs on a specific device.

F: Whether it occurs on a specific batch.

G: Whether it happened at a specific moment.

2: Analysis of common faults.

A: Component placement offset mainly refers to the position shift of X-Y after the components are mounted on the PCB. The reasons for this are as follows:

(1): Reasons for the PCB board

a: The curvature of the PCB board is beyond the allowable range of the device. The upturn is up to 1.2MM and the downturn is up to 0.5MM.

b: The height of the support pins is inconsistent, resulting in uneven printing of the printed board.

c: The flatness of the workbench support platform is poor.

d: The circuit board has low wiring precision and poor consistency, especially the difference between batch and batch.

(2): The suction pressure of the mounting nozzle is too low, and the pick-up and placement should be above 400mmHG.

(3): The blowing pressure is abnormal at the time of placement.

(4): The amount of adhesive and solder paste applied is abnormal or deviated. Causes the component to drift when it is mounted or when it is soldered.Too little causes the component to deviate from the original position when the table is mounted at high speed after the device is mounted. The coating position is not accurate due to its tension,the corresponding offset occurs.

(5): The program data device is incorrect.

(6): The substrate is poorly positioned.

(7): The movement of the mounting nozzle is not smooth and slow.

(8): The coupling between the power unit and the transmission part of the X-Y table is loose.

(9): The head nozzle is not properly installed.

(10): The blowing timing does not match the placement head down timing.

(11): The initial data setting value of the camera of the nozzle center data and the optical recognition system is poor.

B: The device mounting angle offset mainly refers to the angular rotation offset when the device is mounted.The main reasons for this are as follows:

(1): Reasons for the PCB board

a: The warpage of the PCB board exceeds the allowable range of the equipment.

b: The height of the support pins is inconsistent, which makes the printed board support uneven.

C: The flatness of the workbench support platform is poor.

d: The board layout has low precision and poor consistency, especially the difference between batch and batch.

(2): The suction pressure of the mounting nozzle is too low, and the pick-up and placement should be above 400mmHG.

(3): The air pressure is abnormal at the time of placement.

(4): The amount of adhesive and solder paste applied is abnormal or deviated.

(5): The program data device is incorrect.

(6): The end of the nozzle is worn, clogged or stuck with foreign matter.

(7): The rising or rotating motion of the mounting nozzle is not smooth and slow.

(8): Poor parallelism between the nozzle unit and the X-Y table or poor detection of the nozzle origin.

(9): The optical camera is installed with agitation or improper data equipment.

(10): The blowing timing does not match the placement head down timing.

C: Loss of components: mainly refers to the loss of components between the position of picking and the position of the placing.The main reasons for this are as follows:

(1): Program data device error

(2): The suction nozzle sucks the air pressure too low. The removal and placement should be above 400MMHG.

(3): The blowing timing does not match the placement timing.

(4): The attitude detection sensor is defective, and the reference device is incorrect.

(5): Cleaning and maintenance of reflectors and optical recognition cameras.

D: The pickup is not normal:

(1): The tape size does not match the feeder specifications.

(2): The vacuum pump is not working or the suction pressure of the nozzle is too low.

(3): The plastic hot pressing belt braided at the take-up position is not peeled off, and the plastic hot pressing belt is not pulled up normally.

(4): The vertical movement system of the nozzle is slow.

(5): The placement speed of the placement head is incorrectly selected.

(6): The feeder is not installed firmly, the feeder ejector pin is not moving smoothly, the quick-opener and the press belt are bad.

(7): The paper cutter cannot cut the tape normally.

(8): The braid cannot rotate normally with the gear or the feeder does not run continuously.

(9): When the suction position is used, the nozzle is not at a low point, and the drop height is not in place or no action.

(10): The center axis of the nozzle at the take-up position does not coincide with the lead of the center axis of the feeder, and a deviation occurs.

(11): The nozzle drop time is not synchronized with the suction time.

(12): The supply part has vibration

(13): The component thickness data device is incorrect.

(14): The initial value of the suction height is incorrect.

E: Randomness not mounting.

The nozzle is at a low point in the patch position, but do not mount and leak mounting.The main reasons for this are as follows:

(1): The warpage of the PCB is beyond the allowable range of the device, the maximum upturn is 1.2MM, and the lower bend is 0.4MM.

(2): The height of the support pins is inconsistent or the flatness of the platform support platform is poor.

(3): The nozzle is stuck with the fluid or the nozzle is severely magnetized.

(4): L nozzle vertical motion system is slow to run.

(5): The blowing timing does not match the placement head down timing.

(6): The amount of glue on the printed board is insufficient, the leak point or the machine pin is too long.

(7): The nozzle placement height is poor.

(8): The solenoid valve is poorly switched, and the blowing pressure is too small.

(9): When NG occurs in a nozzle, the STOPPER cylinder of the device is not working properly and is not reset in time.

F: Poor pickup posture:

Mainly refers to the appearance of slabs, slanting sheets, etc.The main reasons for this are as follows:

(1): The vacuum suction pressure is poorly adjusted.

(2): The vertical movement system of the nozzle is slow to run.

(3): The nozzle drop time is not synchronized with the suction time.

(4): The initial value of the suction piece height or the component thickness is set incorrectly, and the distance between the suction nozzle and the feeding platform is incorrect at the low point.

(5): The tape packaging specifications are poor, and the components are shaken in the mounting tape.

(6): The feeder ejector pin is not moving smoothly, and the fast carrier and the belt are poor.

(7): The center axis of the feeder does not coincide with the vertical center axis of the nozzle, and the offset is too large.