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The main factors leading to insufficient solder paste

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1. When the printing machine is working, the solder paste is not added in time.

2. The quality of the solder paste is abnormal, and there are foreign objects such as hard lumps mixed with it.

3. Solder paste that has not been used up before has expired and is used for the second time.

4. The quality of the circuit board, there are inconspicuous coverings on the pads, such as solder resist (green oil) printed on the pads.

5. The fixed clamping of the circuit board in the printing machine is loose.

6. Solder paste is missing and the thickness of laser stencil is uneven.

7. Solder paste is missing laser stencil or there are pollutants on the circuit board (such as PCB packaging, SMT stencil wiping paper, foreign objects floating in the ambient air, etc.).

8. The solder paste scraper is damaged and the patch stencil is damaged.

9. The pressure, angle, speed and demolding speed of the solder paste scraper are not properly set.

10. After the solder paste is printed, it is accidentally knocked off due to human factors.