The principle of determining the position of SMT laser steel mesh PCB

It refers to where the printed graphics are placed on the SMT patch stencil. Generally, it is centered on the shape of the PCB; or centered on the pad pattern; or has

Special requirements, such as processing two or more PCB graphics on the same template, etc.

(a) In general, in order to save materials and be economical, the pad pattern can be centered. When printing with the pad pattern centered, a small

The size of the scraper can save solder paste, and can also reduce the spreading area of solder paste, thereby reducing the contact area between solder paste and air, which is beneficial to prevent solder paste

The solvent in the paste evaporates.

(b) When the size of the printed circuit board is relatively large, and the position of the pad pattern is concentrated on one side of the PCB, it should be centered on the shape of the PCB,

If the pad pattern is centered, it may cause the printed circuit board to exceed the working range of the printing machine table during printing. Printed Circuit Board Outline

Centering is the most common method to use.

(c) When the size of the PCB board is small or the range of the pad pattern is small, the double-sided pattern or the missed printing patterns of several PCBs can be made on the same

One piece of SMT patch stencil, which can save the cost of laser stencil processing. However, several product graphics must be provided to the processing plant on the SMT steel mesh

The layout requirements shall be described in words or diagrams.

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