The process of SMT patch red glue

1. Printing method:

The laser stencil engraving hole is determined according to the type of part, the performance of the substrate, its thickness and the size and shape of the hole. Its advantages are high speed and high efficiency.

2. Dispensing method:

Dispensing is to use compressed air to dispense red glue onto the substrate through a special dispensing head. The size and number of glue spots are controlled by parameters such as time and pressure tube diameter. The glue dispenser has flexible functions. For different parts, we can use different dispensing heads, set parameters to change, and also change the shape and number of glue points to achieve the effect. The advantages are convenience, flexibility and stability. The disadvantage is that it is prone to drawing and air bubbles. We can adjust the operating parameters, speed, time, air pressure, and temperature to minimize these shortcomings.

3. Needle rotation method:

A special needle film is immersed in a shallow glue tray. Each needle has a glue point. When the glue point touches the substrate, it will be separated from the needle. The amount of glue can be changed by the shape and diameter of the needle.