Copper plating protective agent

The copper plating layer is not so easy to be oxidized in the air with the copper plating protective agent, and it is more likely to be oxidized. The analysis is very easy to be oxidized and penetrated. The copper is soft and easy to activate, forming a good metal-metal key bond with other metal layers , So as to obtain a good bonding force between the plating. Therefore, copper can be used as an important part of the electrodeposition of many metals, and copper plating occupies an important position in the production process of printed boards. Copper plating on printed circuit boards includes electroless copper plating and copper electroplating, and copper electroplating is an important process in PCB production. The article introduces the process technology of copper electroplating, the operation technical problems that should be paid attention to, and the causes and treatment schemes of some common faults.

The measures for intellectual failures include: Hohoch’s measures for such failures include: Hohoch’s ear groove test or depending on the situation to control the consumption of brightener in the preparation; do not think that the more light, the sooner it will recover. When the more brightener is added, the less bright it is, consider whether it is excessive. At this time, if a small amount of hydrogen peroxide is added, the treatment concentration will increase, and part of the brightener should be disposed of. . For any assistance, we must adhere to the principle of increasing less and increasing frequently.

Brightening agent parts development (such as M, N-type copper plating), in the long-term production practice, with a dazzling brightener, in order to be proportional. If the consumption of the polydithiopropane plane in the bath at different bath temperatures, the consumption ratio of M and N is also different. To obtain a general supplement ratio, consider the ratio at 25°C to 30°C. The most ideal situation is to prepare standard solutions for various brighteners, and frequently use the Hall groove to test and adjust.

Control the content of chloride ions in the plating solution. If you suspect that it is the cause of the chloride ions in the plating solution, you must first verify it. Do not add acidity adjustment in the seminar tank. It is also very important to control the content of copper and oxidation in the plating solution. It is also related to the lead wire and the phosphorus content involved.

The accumulation of brightener decomposition products in the plating solution will cause poor brightness and leveling of the coating, and the low current density area will not be bright. When it is found that the consumption of brightener with the same proportion under the conditions of similar bath temperature is much higher than the normal value, it should be suspected that there are too many organic impurities. Too much organic solvent, there is no copper powder in the plating solution; but copper powdery precipitates with poor adhesion will be precipitated on the plating layer. At this time, the organic impurities in the plating solution should be treated. In addition, do not ignore the adverse effects of organic impurities on the brightness of low current density areas. The sensitivity to organic impurities is particularly strong when the current is small. Practice has proved that the bright copper plating solution that has not been treated for a long time, with 39/L high-quality activated carbon alone to absorb organic impurities, the full brightness range of the low current density area of the Hall groove test piece may be extended by a few millimeters.